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ASUS ROG RG-07 Performance Thermal Paste Kit - 3g High Conductivity Cooling Paste for CPU & GPU | 2.5 W/m.k Thermal Compound with Application Tools

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2 Years Warranty.

  • Premium Heat Conductivity: The ASUS ROG RG-07 Performance Thermal Paste delivers exceptional thermal absorption rated at 2.5 W/m.k for optimal cooling performance
  • 3 Grams Quantity: Generous amount suitable for multiple applications across processors and graphics cards
  • Smooth Application: Easy-spread formula ensures even coverage between CPU and cooler for maximum heat transfer
  • Complete Application Kit: Includes spreader, clean wipes, and stencils compatible with Intel 115x/1200/1700 and AMD AM4/AM5 processors
  • Universal Compatibility: Works perfectly with all processors and graphics cards for versatile system cooling
  • Professional-Grade Formula: Designed to fill microscopic gaps completely for superior thermal conduction

3,300
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ID-COOLING Frost X45 4g Thermal Paste - High Performance CPU/GPU Thermal Compound 15.2 W/m·K

0 out of 5

2 Years Warranty.

  • Experience superior cooling with the ID-COOLING Frost X45 Thermal Paste, featuring an exceptional thermal conductivity of 15.2 W/m·K.

  • Safeguard your expensive CPU and GPU components thanks to its metal-free, completely non-conductive and non-capacitive formula.

  • Enjoy long-term, stable performance as this paste resists drying, cracking, or separation over time.

  • Achieve a perfect, even application every time with its ideal viscosity that spreads smoothly without mess.

2,000
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ID-COOLING FROST-PTM 2 Thermal Paste – High-Performance 8.5 W/m-K Thermal Pads for GPUs (2 Pads, 40x40mm)

0 out of 5

2 Years Warranty.

  • ID-COOLING FROST-PTM 2 thermal pads deliver 8.5 W/m-K thermal conductivity for rapid heat transfer.
  • Each pack includes two 40x40x0.2mm gray pads, ideal for GPU and CPU applications.
  • Operates reliably from -40°C to 200°C, suited for intense gaming or workstation builds.
  • Easy peel-and-stick installation—no messy grease, perfect for beginners and pros alike.
  • Low thermal impedance (0.04°C-cm²/W) ensures minimal resistance between components and heatsinks.
  • Fully compatible with Intel and AMD systems, offering versatile thermal solutions.

2,000
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